Ni(Pt)Si硅化物温度稳定性的研究

对比研究了夹层结构N i/P t/N i分别与掺杂p型多晶硅和n型单晶硅进行快速热退火形成的硅化物薄膜的电学特性。实验结果表明,在600~800°C范围内,掺P t的N iS i薄膜电阻率低且均匀,比具有低电阻率的镍硅化物的温度范围扩大了100~150°C。依据吉布斯自由能理论,对在N i(P t)S i薄膜中掺有2%和4%的P t样品进行了分析。结果表明,掺少量的P t可以推迟N iS i向N iS i2的转化温度,提高了镍硅化物的热稳定性。最后,制作了I-V特性良好的N i(P t)S i/S i肖特基势垒二极管,更进一步证明了掺少量的P t改善了N iS i肖特基二极管的稳定性。

Investigation on Temperature Stability of Ni(Pt)Si Silicide

This article puts forward that sandwich Ni/Pt/Ni structures makes solid phase silicidation with p-type polysilicon and n-type Si(100) substrates respectively.The sheet resistance of above samples is measured.It is found that becuase of Pt addition,the sheet resistance of Ni(Pt)Si turns low and uniform in the range of 600～800(°C),and the windows of Ni(Pt)Si silicide is 100～150(°C) wider than the one of low sheet resistance silicide-NiSi.Furthermore,according to the theroy on Gibbs free energy,two kinds of samples about 2% and 4% ratio of Pt element in Ni(Pt)Si silicide are analyzed,the results show that adding a little quantity of Pt element can postpone the phase transformation from NiSi to NiSi_2 and enhance the thermal stability of nickel monosilicide.Finally,Ni(Pt)Si/Si schottky barrier diode is fabricated and has good I-V characteristics.This proves farther that adding a small quantity of Pt in Ni film can improve the stability of NiSi/Si schottky barrier diode.