| 连接温度对T91／12Cr2MoWVTiB TLP连接接头组织和性能的影响 |
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| 引用本文： | 郭世敬,陈思杰,梁峰. 连接温度对T91／12Cr2MoWVTiB TLP连接接头组织和性能的影响[J]. 新技术新工艺, 2009, 0(10): 98-100 |
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| 作者姓名： | 郭世敬 陈思杰 梁峰 |
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| 作者单位： | 河南理工大学材料科学与工程学院,河南焦作454003 |
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| 基金项目： | 河南理工大学教学改革专项基金资助项目 |
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| 摘 要： | 连接温度是完成瞬时液相扩散连接、保证焊接接头性能的关键参数，采用不同连接温度1210℃、1230℃和1250℃对T91／12Cr2MowVTiB进行瞬时液相扩散连接，连接压力为2MPa，保温时间为4min，结果表明，在1210～1250℃范围内，随着温度的增加，焊接接头的成分越来越均匀，连接区域的显微硬度分布逐渐趋于平缓，接头的力学性能也随之提高。
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| 关 键 词： | 连接温度 瞬时液相扩散 成分 显微硬度 力学性能 |
Effect of Bonding Temperature on the Microstructure and Properties of T91/12Cr2MoWVTiB Welded Joint |
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| GUO Shijing,CHEN Sijie,LIANG Feng. Effect of Bonding Temperature on the Microstructure and Properties of T91/12Cr2MoWVTiB Welded Joint[J]. New Technology & New Process, 2009, 0(10): 98-100 |
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| Authors: | GUO Shijing CHEN Sijie LIANG Feng |
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| Affiliation: | (School of Materials Science ＆ Engineering, Henan Polytechnic University,Jiaozuo 454003 ,China) |
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| Abstract: | The bonding temperature is the key parameters for transient liquid phase diffusion welding and welded joint properties. In this paper, transient liquid phase diffusion welding experiments for T91/12Cr2MoWVTiB are carried out at different temperature： 1 210 ℃ ,1 230 ℃ and 1 250 ℃ with the holding time of 4 min and the pressure of 2 MPa. The resuits show that, the chemical compositions of the joints become more and more homogenized, the microhardness becomes gently and the mechanical properties also become better and better with the increasing of the bonding temperature from 1 210to 1 250℃. |
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| Keywords: | Bonding temperature Transient liquid phase diffusion Chemical compositions Microhardness Mechanical properties |
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