|
|||||
|
|
Comparison of the copper and gold wire bonding processes for LED packaging |
|
| Authors: | Chen Zhaohui Liu Yong Liu Sheng |
| Affiliation: | 1. Research Institute of Micro/Nano Science and Technology, Shanghai Jiaotong University, Shanghai 200240, China 2. Wuhan National Laboratory for Optoelectronics, Huazhong University of Science & Technology, Wuhan 430074, China 3. Research Institute of Micro/Nano Science and Technology, Shanghai Jiaotong University, Shanghai 200240, China;Wuhan National Laboratory for Optoelectronics, Huazhong University of Science & Technology, Wuhan 430074, China;Institute of Microsystems, School of Mechanical Science and Engineering,Huazhong University of Science & Technology,Wuhan 430074,China |
| Abstract: | Wire bonding is one of the main processes of the LED packaging which provides electrical interconnection between the LED chip and lead frame.The gold wire bonding process has been widely used in LED packaging industry currently.However,due to the high cost of gold wire,copper wire bonding is a good substitute for the gold wire bonding which can lead to significant cost saving.In this paper,the copper and gold wire bonding processes on the high power LED chip are compared and analyzed with finite element sim... |
| Keywords: | LED packaging wire bonding copper wire FEM |
| 本文献已被 CNKI 万方数据 等数据库收录！ | |
| 点击此处可从《半导体学报》浏览原始摘要信息 | |
| 点击此处可从《半导体学报》下载全文 | |