金属支架0.5 W红外发光二极管研究

设计了一种采用金属支架直接导热的大功率红外发光二极管封装结构.该封装结构通过增加芯片底部金属座的厚度和尺寸,有效改善了散热性能,降低了封装热阻.实验测量表明,大功率红外发光二极管峰值波长为850nm,发光束角10°,典型输入功率为0.5W,最大输入功率可以达到2W以上,最大电光转换效率可达37.82%,最大辐射功率达到415.25 mW.

Abstract：

Using metal framework for heat conduction,a new packaging structure for power infrared light-emitting diode (LED) is introduced.This structure improves the heat dissipation effectively by increasing the size and the thickness of the metal framework.Experiment results show that the peak wavelength of the infrared LED is 850 nm,with the beam angle of 10° The typical input power is 0.5 W,and the maximum input power can reach higher than 2 W.The largest electro-optical conversion efficiency is up to 37.82%,and the largest radiation power reaches 415.25 mW.

Study on 0.5 W Metal Framework Infrared LED

Using metal framework for heat conduction,a new packaging structure for power infrared light-emitting diode (LED) is introduced.This structure improves the heat dissipation effectively by increasing the size and the thickness of the metal framework.Experiment results show that the peak wavelength of the infrared LED is 850 nm,with the beam angle of 10° The typical input power is 0.5 W,and the maximum input power can reach higher than 2 W.The largest electro-optical conversion efficiency is up to 37.82%,and the largest radiation power reaches 415.25 mW.