Spacing optimization of high power LED arrays for solid state lighting |
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| Authors: | Y. Sing Chan S.W. Picky Lee |
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| Affiliation: | Electronic Packaging Laboratory,Center for Advanced Microsystems Packaging,Hong Kong University of Science and Technology, Hong Kong,China |
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| Abstract: | This paper provides an analytical approach to determine the optimum pitch by utilizing a thermal resistance network,under the assumption of constant luminous efficiency.This work allows an LED array design which is mounted on a printed circuit board(PCB) attached with a heat sink subject to the natural convection cooling. Being validated by finite element(FE) models,the current approach can be shown as an effective method for the determination of optimal component spacing in an LED array assembly for SSL. |
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| Keywords: | high power LED thermal resistance network finite element modeling |
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