Dynamic recrystallization in a near-eutectic Pb-Sn-Ag alloy under thermal cycling |
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| Authors: | S. A. Atroshenko D. R. Lyu I. Sh. Pao |
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| Affiliation: | (1) Institute of Problems in Mechanical Engineering, Russian Academy of Sciences, St. Petersburg;(2) Ford Research Laboratory, Detroit |
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| Abstract: | An analysis is made of the behavior of solders under thermal cycling. Dynamic recrystallization can be used to explain the evolution of the microstructure of soldered joints during operation. Pis’ma Zh. Tekh. Fiz. 24, 28–31 (May 12, 1998) |
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