不同升温速率下模块装药慢速烤燃特性的数值模拟

为分析模块装药在外界热刺激下的热稳定性，开展了模块装药慢速烤燃特性的研究。建立模块装药慢速烤燃模型，在1.8 K/h、3.6 K/h和 7.2 K/h 3种升温速率下进行数值模拟计算。结果表明：在慢速烤燃条件下，升温速率较低（1.8 K/h、3.6 K/h）时，烤燃响应区域靠近中心传火管；升温速率较高（7.2 K/h）时，烤燃响应区域已不再靠近中心传火管的位置。由此可见，升温速率对模块装药着火时间和烤燃响应区域位置有较大的影响。随着升温速率的提高，着火时间变短，烤燃响应区域向单基药中心移动，烤燃响应区域由一个中心环形区域变成关于中心对称的两个环形区域，升温速率对烤燃响应区域的着火温度影响较小。

Simulation of Slow Cook-off for Modular Charges at Different Heating Rates

The slow cook-off characteristics of modular charge at different heating rates are investigated for analyzing the thermal stability of modular charge under external stimulus. A slow cook-off model for the modular charge was established, and the numerical simulation calculations at the heating rates of 1.8 K/h, 3.6 K/h and 7.2 K/h were made. The results show that the ignition area occurs inside the single base powder near the central flash tube when the heating rate is low（1.8 K/h and 3.6 K/h ）during slow cook-off. When the heating rate is high（7.2 K/h）, the ignition area is no longer near the single base powder near the central flash tube. The heating rate has a great effect on the ignition time and the ignition position. As the heating rate increases, the ignition time is shorted, and the ignition area moves toward the center of single base powder. The burning response area changes from a central annular area to two annular areas that are symmetric about the center. The change of heating rate has limited impact on the ignition temperature.