| 用热弯实验方法决定导电薄膜的热膨胀系数 |
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| 引用本文： | 沈为,彭立华,李伟,邓泽贤.用热弯实验方法决定导电薄膜的热膨胀系数[J].复合材料学报,2001,18(2):90-93. |
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| 作者姓名： | 沈为 彭立华 李伟 邓泽贤 |
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| 作者单位： | 1.华中理工大学 力学系,武汉 430074; |
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| 基金项目： | 国家自然科学基金项目 !(196 72 0 19,19972 0 2 2 ) |
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| 摘 要： | 研究了热-力载荷下薄膜/基板复合梁的弯曲问题,导出了薄膜的热膨胀系数与试样表面的温度和变形之间的关系式;提出一种测量导电薄膜的热膨胀系数的方法,并用热弯实验测SnO2膜的热膨胀系数。
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| 关 键 词： | 导电膜/玻璃 热膨胀系数 电热效应 热弯实验 |
| 文章编号： | 1000-3851(2001)02-0090-04 |
| 收稿时间： | 2000-01-19 |
| 修稿时间： | 2000年1月19日 |
DETERMINING THERMAL EXPANSION COEFFICIENT OF CONDUCTIVE THIN FILM BY THERMAL BEND TEST |
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| SHEN Wei,PENG Li-hua,LI Wei,Tang C Y.DETERMINING THERMAL EXPANSION COEFFICIENT OF CONDUCTIVE THIN FILM BY THERMAL BEND TEST[J].Acta Materiae Compositae Sinica,2001,18(2):90-93. |
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| Authors: | SHEN Wei PENG Li-hua LI Wei Tang C Y |
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| Affiliation: | 1.Department of Mechanics, Huazhong University of Science and Technology, 430074,China;2.Structure Mechanics Research Group, Wuhan University of Hydraulic and Electric Engineering, 430072,China;3.Department of Manufacturing Engineering, The Hong Kong Polytechnic University,Hong Kong, China |
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| Abstract: | The bending problem of thin film/substrate composite subjected to thermal load is studied. The relation between the thermal expansion coefficient of conductive thin films, temperature and deformation of specimen surfaces is derived in this paper. Based on the findings, a method for measuring the thermal expansion coefficient of conductive thin films is developed. The thermal expansion coefficient of conductive thin films has been measured by applying the method in a thermal bend test. |
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| Keywords: | conductive thin film thermal expansion coefficient electro thermal effect thermal bend test |
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