| 硅／硅直接键合制备p^＋／n^—和n^—／n^—结构 |
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| 引用本文： | 林长贵,崔吾元.硅／硅直接键合制备p^＋／n^—和n^—／n^—结构[J].微电子学,1992,22(5):39-41. |
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| 作者姓名： | 林长贵 崔吾元 |
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| 作者单位： | 西安交通大学电子工程系，西安交通大学电子工程系，西安交通大学电子工程系 陕西西安 710049，陕西西安 710049，陕西西安 710049 |
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| 摘 要： | 本文采用Si/Si直接键合制备p~+/n~-、n~-/n~-结构的工艺原理及方法。通过实验,摸索出了一种有效的表面清洗-高温处理Si/Si键合工艺;采用该工艺制出了p~+/n~-、n~-/n~-样片;对键合的微观结构、键合强度、杂质分布及电接触特性进行了检测。
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| 关 键 词： | 键合 硅膜 欧姆接触 硅 |
Preparation of p~+/n~- and n~- /n~- Silicon Wafers by Si/Si Direct Bonding |
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| Lin Changgui,Cui Wuyuan and Luo Jinsheng
Deft. Electronic Engineering,Xi'an Jiaotong University,Xi'an',Shaanxi.Preparation of p~+/n~- and n~- /n~- Silicon Wafers by Si/Si Direct Bonding[J].Microelectronics,1992,22(5):39-41. |
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| Authors: | Lin Changgui Cui Wuyuan and Luo Jinsheng
Deft Electronic Engineering Xi'an Jiaotong University Xi'an' Shaanxi |
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| Affiliation: | Lin Changgui,Cui Wuyuan and Luo Jinsheng
Deft. Electronic Engineering,Xi'an Jiaotong University,710049,Xi'an',Shaanxi |
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| Abstract: | The technique for preparation of p+/n- Si warers by Si/Si direct bonding is described in the paper. An effective process for silicon-to-silicon bonding combining prebonding surface cleaning with thermal treatment bas been developed through our experiments. Sample wafers with p+/n- and n-/n- structures were made using this process. The mi-crostructure of the bonding interface,the bonding strength,the profile of impurities and the electric contact characteristics were measured and results are presented. |
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| Keywords: | Bonding Silicon film Ohmic-contact |
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