| 印制板用的耐热性环氧一硅复合树脂基材 |
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| 引用本文： | 蔡积庆. 印制板用的耐热性环氧一硅复合树脂基材[J]. 印制电路信息, 2006, 1(9): 23-27 |
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| 作者姓名： | 蔡积庆 |
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| 摘 要： | 概述了基于新概念的环氧-硅复合树脂的开发,并证实了传统FR-5基材的制造工艺可以适用于环氧-硅复合树脂的覆铜箔板制造.
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| 关 键 词： | 覆铜箔板 环氧-硅复合树脂 耐热性基材 无铅焊料 溶胶-凝胶反应 |
Heat-Resistant Epoxy-Silicon Hybrid Materials for Printed Circuit Boards |
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| Cai Jiqing. Heat-Resistant Epoxy-Silicon Hybrid Materials for Printed Circuit Boards[J]. Printed Circuit Information, 2006, 1(9): 23-27 |
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| Authors: | Cai Jiqing |
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| Abstract: | This paper describes the development of the epoxy-silicon hybrid resin based on a new concept.It was confirmed that convention fabrication process for FR-5 laminate was applicable to copper-clad laminates fabrication for the epocy-silicon hybrid resin. |
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| Keywords: | copper-clad laminate epoxy-silicon hybrid resin heat-resistant material Pb-free solder sol-gel reaction |
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