| 芯片粘接工艺对MEMS性能影响的单元库法模型 |
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| 引用本文： | 宋竞,黄庆安,唐洁影.芯片粘接工艺对MEMS性能影响的单元库法模型[J].半导体学报,2006,27(1):156-161. |
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| 作者姓名： | 宋竞 黄庆安 唐洁影 |
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| 作者单位： | 东南大学MEMS教育部重点实验室,南京,210096;东南大学MEMS教育部重点实验室,南京,210096;东南大学MEMS教育部重点实验室,南京,210096 |
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| 摘 要： | 芯片粘接工艺引起的器件-封装热失配会对MEMS器件的可靠性和性能产生显著影响.常用FEM模拟在分析此类问题时比较费时且缺乏明确的理论意义.文中基于单元库法思路提出了该类问题的理论建模方法,并依此举例分析了芯片粘接工艺中各可变参数对双端固支梁pull-in电压的影响,其结论与Ansys模拟结果一致.该方法简单准确,对MEMS的封装-器件协同设计将有着实际的意义.
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| 关 键 词： | MEMS封装 协同设计 芯片粘接 单元库法 step-up锚区 |
| 文章编号： | 0253-4177(2006)01-0156-06 |
| 收稿时间： | 07 23 2005 12:00AM |
| 修稿时间： | 09 17 2005 12:00AM |
Effects of Die Bonding on MEMS Characteristics:Cell Library |
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| Song Jing,Huang Qing''''an,Tang Jieying.Effects of Die Bonding on MEMS Characteristics:Cell Library[J].Chinese Journal of Semiconductors,2006,27(1):156-161. |
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| Authors: | Song Jing Huang Qing'an Tang Jieying |
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| Affiliation: | Key Laboratory of MEMS of Ministry of Education,Southeast University,Nanjing 210096,China;Key Laboratory of MEMS of Ministry of Education,Southeast University,Nanjing 210096,China;Key Laboratory of MEMS of Ministry of Education,Southeast University,Nanjing 210096,China |
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| Abstract: | Thermal mismatch induced by the die bonding structure greatly affects the reliability and performance of MEMS devices.A cell library method,as an alternative conventional FEM simulation,is introduced here to simplify the package-device co-design and the parametric study of MEMS components.Effects of the die bonding process on the pull-in voltage of a doubly supported micro-beam are predicted using this method, and the results are in good agreement with the FEM calculations.This method has the advantages of simplicity and accuracy and application to the co-design of the overall system of the packaged MEMS devices. |
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| Keywords: | MEMS package co-design die bonding cell library step-up anchor |
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