A high-density, four-channel, OEIC transceiver module utilizingplanar-processed optical waveguides and flip-chip, solder-bumptechnology |
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Authors: | Jackson KP Flint EB Cina MF Lacey D Kwark Y Trewhella JM Caulfield T Buchmann P Harder Ch Vettiger P |
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Affiliation: | IBM Thomas J. Watson Res. Center, Yorktown Heights, NY; |
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Abstract: | An optoelectronic transceiver module is described consisting of a four-channel AlGaAs integrated laser/monitor transmitter and a four-channel GaAs MESFET integrated detector/preamp receiver. The optoelectronic chips are flip-chip, solder-bump bonded to a substrate containing electrical wiring and planar-processed optical waveguides. The optical waveguide layer serves two purposes: the routing of optical signals, as well providing mechanical registrations for the optoelectronic chips and fiber-optic ribbon connector. The work described here demonstrates one approach to high-density, optoelectronic array packaging compatible with existing high-performance electronic packaging technology |
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