| 多芯片组件带网孔接地板多导体互连线结构的电磁特性分析 |
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| 引用本文： | 薛志勇 李征帆. 多芯片组件带网孔接地板多导体互连线结构的电磁特性分析[J]. 电子学报, 1996, 24(3): 65-67 |
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| 作者姓名： | 薛志勇 李征帆 |
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| 作者单位： | 上海交通大学电子工程系 |
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| 摘 要： | 本文给出一基于准静态场的直线法,来分析多芯片组件（ＭＣＭ）带有网孔接地板的多层多导体互连线结构的分析方法,以此提取等效传输线的特性参数。最后给出几个实例的计算结果。
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| 关 键 词： | 多芯片组件 多导体互连线 电磁特性 |
Electrical Performance of Multiconductor Interconnects for MCM with Perforated Reference Planes |
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| Xue Zhiyong,Li Zhengfan. Electrical Performance of Multiconductor Interconnects for MCM with Perforated Reference Planes[J]. Acta Electronica Sinica, 1996, 24(3): 65-67 |
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| Authors: | Xue Zhiyong Li Zhengfan |
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| Abstract: | A quasi-static approach is demonstrated for the equivalent transmission line characterization of multiconductor interconnects for multichip-module(MCM) with perforated reference planes by using the "method of lines". The proposed method can be used to extract effective transmission line parameters for multiconductor interconnects. The results of some examples are also given. |
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| Keywords: | MCM Multiconductor Interconnect Elecotromagnetic parameters extraction |
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