| Sn-9Zn钎料与内加Cu质点和Cu基体界面生长行为 |
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| 引用本文： | 卫国强,况敏,杨永强,赵利.Sn-9Zn钎料与内加Cu质点和Cu基体界面生长行为[J].中国有色金属学报,2007,17(7):1083-1089. |
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| 作者姓名： | 卫国强 况敏 杨永强 赵利 |
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| 作者单位： | 1. 华南理工大学,机械工程学院,广州,510641
2. 广州有色金属研究院,材料表面中心,广州,510651 |
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| 摘 要： | 在Sn-9Zn无铅钎料中加入Cu金属质点,研究在长时间钎焊条件下钎料/Cu质点、钎料/Cu基体界面金属间化合物（IMCs）的生长行为。结果表明：在钎料/Cu质点和钎料/Cu基体界面处都生成Cu-Zn相（IMCs）,其组成为Cu5Zn8＋CuZn或Cu5Zn8,而且钎料/质点界面处IMCs的生长速度明显快于钎料/基体处;同时发现,Cu质点的加入大大减小了钎料/Cu基体界面IMCs的厚度。由于Cu质点原位生成Cu-Zn IMCs,消耗了焊点中的Zn,因此Sn-9Zn/Cu接头的可靠性得以提高。
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| 关 键 词： | Sn-9Zn钎料 无铅钎料 Cu质点 金属间化合物 |
| 文章编号： | 1004-0609（2007）07-1083-07 |
| 收稿时间： | 2006-09-04 |
| 修稿时间： | 2007-05-08 |
Interfacial growth behavior of Sn-9Zn/additive Cu-particles and Sn-9Zn/Cu-substrate |
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| WEI Guo-qiang,KUANG Min,YANG Yong-qiang,ZHAO Li.Interfacial growth behavior of Sn-9Zn/additive Cu-particles and Sn-9Zn/Cu-substrate[J].The Chinese Journal of Nonferrous Metals,2007,17(7):1083-1089. |
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| Authors: | WEI Guo-qiang KUANG Min YANG Yong-qiang ZHAO Li |
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| Affiliation: | 1. College of Mechanical Engineering, South China University of Technology, Guangzhou 510641, China; 2. Materials Surface Centre, Guangzhou Research Institute of Nonferrous Metals, Guangzhou 510651, China |
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| Abstract: | The growth behavior of interfacial intermetallic compounds(IMCs) of Sn-9Zn/additive Cu-particles and Sn-9Zn additive Cu-substrate was investigated under the condition of extended soldering time.The results show that the Cu-Zn phases,which are composed of Cu5Zn8 and CuZn or Cu5Zn8,are formed at the interfaces of both Sn-9Zn/Cu-particles and Sn-9Zn/Cu-substrate,simultaneously the growth rate of IMCs of Sn-9Zn/Cu-particles is markedly higher than that of Sn-9Zn/Cu-substrate.It is also shown that the addition of Cu-particles in Sn-9Zn solder greatly reduces the thickness of IMCs layer of Sn-9Zn/Cu-substrate.The reliability for Sn-9Zn/Cu joint is improved for the diminished Zn content in soldering joint due to the in-situ formation of IMCs of Sn-9Zn/Cu-particles. |
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| Keywords: | Sn-9Zn solder lead-free solder Cu-particle intermetallic compound(IMCs) |
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