| 反应磁控溅射工艺中的滞后效应研究 |
| |
| 引用本文： | 常天海. 反应磁控溅射工艺中的滞后效应研究[J]. 真空与低温, 2003, 9(4): 191-194 |
| |
| 作者姓名： | 常天海 |
| |
| 作者单位： | 华南理工大学,电信学院,广东,广州,510640 |
| |
| 摘 要： | 研究了反应磁控溅射的动力学过程。理论分析与试验结果表明:反应气体流量随其压力的变化呈滞后效应,最佳镀膜工艺位于滞后区域。给出了金属靶阴极表面溅射清洗效果的伏安特性评价法,为克服"靶中毒"提供了有效的技术途径。
|
| 关 键 词： | 反应磁控溅射 动力学过程 滞后效应 |
| 文章编号： | 1006-7086(2003)04-0191-04 |
| 修稿时间： | 2003-05-26 |
STUDY ON THE HYSTERESIS EFFECT IN THE REACTIVE MAGNETRON SPUTTERING TECHNICS |
| |
| CHANG Tian-hai. STUDY ON THE HYSTERESIS EFFECT IN THE REACTIVE MAGNETRON SPUTTERING TECHNICS[J]. Vacuum and Cryogenics, 2003, 9(4): 191-194 |
| |
| Authors: | CHANG Tian-hai |
| |
| Abstract: | The kinetic process of reactive magnetron sputtering has been studied. Theoretical analysis and experimental results have showed that the mutual relationships between flow rates and partial pressures of reactive gases exhibiting hysteresis effect, and optimum plating technics locate in its hysteresis region.The evaluating method of sputtering cleanout effect on metal target surface by volt-ampere characteristic of target cathode has been given,which provides effective approach to eliminate "target poisoning". |
| |
| Keywords: | reactive magnetron sputtering kinetic process hysteresis effect |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
|
