极紫外多层膜基底表面粗糙度综合表征技术

研究用不同清洗方法对硅基底表面粗糙度的影响,首先使用原子力显微镜(AFM)直接测量硅片表面粗糙度;然后,利用直流磁控溅射方法,在相同制备工艺条件下镀制M o/S i多层膜,使用X射线衍射仪(XRD)对多层膜二级衍射峰进行摇摆曲线扫描;最后,利用同步辐射测量多层膜的反射率,间接表征基底的粗糙度。结果表明,超声清洗后镀制的多层膜反射率最高,结论与AFM,XRD等表征方法一致。

Combination of surface characterization techniques for analyzing the roughness of the substrate

The extreme ultraviolet(EUV) molybdenum/silicon(Mo/Si) multilayers were fabricated using the direct current magnetron sputtering method on different preparation substrate:(a) wiped method,(b) untreated and(c) ultrasonic cleaning method.To meet the requirement of comprehensive characterization of morphology of substrates for EUV multilayer,a suitable combination of different measuring techniques,such as atomic force microscopy (AFM),X-ray diffractometer(XRD) rocking curve and synchrotron radiation(SR) reflectance,were chosen.The maximum reflectance was obtained using the substrate prepared by the ultrasonic cleaning method.It is demonstrated on the analysis according to the experimental results that the combination of surface characterization techniques using the AFM,X-ray scattering technique and SR characterization can be used for investigating the detail topography information of the substrate.