| CPU芯片的散热问题 |
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| 引用本文： | 杨屏,李刚.CPU芯片的散热问题[J].办公自动化,2012(10):28-29. |
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| 作者姓名： | 杨屏 李刚 |
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| 作者单位： | 北京电子科技职业学院 |
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| 摘 要： | 在计算机的使用过程中人们常常遇到由于CPU芯片过热导致停机的现象,一直都没有找到解决问题的方法。通过对计算机硬件系统CPU主板结构的拆装分析,多次实践后终于找出了解决问题的几种方法,同时并用效果更好。事实证明,此项研究基本解决了CPU芯片的散热问题,实用性强,易于推广。
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| 关 键 词： | CPU芯片 散热片 通风孔 间隙 |
Problems of the CPU Chip Heat Dissipation |
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| Yang Ping Li Gang.Problems of the CPU Chip Heat Dissipation[J].Office Automation,2012(10):28-29. |
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| Authors: | Yang Ping Li Gang |
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| Affiliation: | Yang Ping Li Gang(Beijing Vocational College of Electronis Science Beijing 100026) |
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| Abstract: | In the use of computers people often encounter this phenomenon that the CPU chip overheating lead to shutdown,the methods to solve the problems have been found none.Through disassembling and analysis the CPU motherboard structure of the computer hardware system,several methods to solve the problem finally find out by many practice.The result is better with several methods together.Proven,the study is basically solved the problem of the CPU chip heat dissipation.It has strong practicability and is easy to generalize. |
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| Keywords: | The CPU chip Heat sink Antrum Clearance |
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