SoC and SiP, the Yin and Yang of the Tao for the New Electronic Era

“More than Moore” is becoming the password for these coming years. New steps to overcome technology limitations to diffuse, on the same die, different chips to have a complete system have been developed. This approach is called system in package (SiP), a way to have in a package dies of logic, analog, memory, passive components, etc., assembled to obtain a miniaturized board. SiP performances and limitations are here analyzed to understand advantages versus system on chip (SoC). This paper is a discussion about the main items that can lead to the choice of the right approach—SiP or SoC—before a system design start. Three persons attend to our virtual meeting: an SoC technology development manager, expert in microcontroller embedded memories and technology integration; an SiP analog radio-frequency design senior expert; and a moderator that designed embedded memories and now SiP, all involved to understand how to reach a tradeoff among these two approaches. Like for the Yin and Yang, symbol of the equilibrium for the Taoist philosophy, the two opposites divide the circle of the life, with a piece of each in the other.