| 基于MCM的环型行波超声波电机驱动集成单元的热分析 |
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| 引用本文： | 顾菊平,胡敏强,金龙,韩群飞,王德明,王爱军.基于MCM的环型行波超声波电机驱动集成单元的热分析[J].电工技术学报,2010(2). |
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| 作者姓名： | 顾菊平 胡敏强 金龙 韩群飞 王德明 王爱军 |
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| 作者单位： | 南通大学电气工程学院;东南大学电气工程学院;南京工业大学自动化与电气学院; |
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| 基金项目： | 国家自然科学基金(60605024,60975064);;江苏省333;;青蓝工程;;六大人才(07-A-023,08KJB510017)资助项目 |
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| 摘 要： | 应用多芯片组件(MCM)技术,对超声波电机驱动单元的集成技术进行了初步探索;建立了MCM的三维有限元的热分析模型,并在空气自然对流情况下,对温度分布和散热状况进行了模拟计算;定量分析了空气强迫对流MCM模型温度分布和散热状况的影响。模拟分析结果为基于MCM的超声波电机驱动单元的设计提供了重要的理论依据,对于提高同类产品本身的整体性能和国际竞争力具有重要的理论意义和实用价值。
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| 关 键 词： | 芯片组件 三维模型 热分析 有限元 |
Thermal Analysis of Driving-Unit for Ring-Type Traveling-Wave Ultrasonic Motor Based on MCM |
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| Gu Juping, Hu Minqiang Jin Long Han Qunfei Wang Deming Wang Aijun.Thermal Analysis of Driving-Unit for Ring-Type Traveling-Wave Ultrasonic Motor Based on MCM[J].Transactions of China Electrotechnical Society,2010(2). |
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| Authors: | Gu Juping Hu Minqiang Jin Long Han Qunfei Wang Deming Wang Aijun |
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| Affiliation: | 1.Nantong University Nantong 226019 China 2.Southeast University Nanjing 210096 China 3.Nanjing University of Technology 210009 China |
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| Abstract: | Based on the multi-chip module(MCM)technique,one integrated circuit unit driving for ring-type traveling-wave ultrasonic motor(RTWUSM)is designed in this paper.The 3-dimensional thermal analysis model used by finite element method(FEM)is also been built in this paper.The temperature distribution and radiating condition are calculated under air free convection,and then the quantitative analysis is made for the IC driving for RTUSM based on MCM technique under air forced convection.The results are the foundat... |
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| Keywords: | MCM 3D model thermal analysis FEM |
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