| 一种崭新的镀膜技术--等离子体束溅射 |
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| 引用本文： | M.J.Thwaites,王晓伟,方立武.一种崭新的镀膜技术--等离子体束溅射[J].真空,2005,42(1):43-45. |
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| 作者姓名： | M.J.Thwaites 王晓伟 方立武 |
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| 作者单位： | 1. Plasma Quest Limited,英国
2. 北京利方达真空技术有限责任公司,北京,100029 |
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| 摘 要： | 详细描述一种等离子体高效溅射系统及应用工艺.此种崭新的溅射技术结合了蒸发镀的高效及溅射镀的高性能特点,特别在多元合金以及磁性薄膜的制备,具有其他手段无可比拟的优点.
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| 关 键 词： | 高利用率等离子体溅射 共溅射 汇聚线圈 |
| 文章编号： | 1002-0322(2005)01-0043-03 |
High target utilization plasma sputtering:a brand-new thin-film deposition technclogy |
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| M.J.Thwaites.High target utilization plasma sputtering:a brand-new thin-film deposition technclogy[J].Vacuum,2005,42(1):43-45. |
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| Authors: | MJThwaites |
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| Abstract: | Introduces the High Target Utilization Plasma Sputtering Technology. This brand-new sputtering technology combines the advantages of evaporation deposition and sputtering deposition, especially it is availabe to utilize for preparing multi-alloy and magnetic films. It has the unique advantages in comparison with other thin film technologies. |
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| Keywords: | High Target Utilization Plasma Sputtering(HiTUS) co-sputtering convergence coil |
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