Microstructure of diffusion-bonded joints in Al-Li 8090 alloy |
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| Authors: | C. J. Gilmore D. V. Dunford P. G. Partridge |
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| Affiliation: | (1) Materials and Structures Department, Royal Aerospace Establishment, Farnborough, UK |
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| Abstract: | Joints were produced between Al-Li 8090 alloy sheet by solid state (SSDB) and transient liquid-phase (TLPDB) diffusion-bonding techniques. The bond interface was a planar, thermally stable, large-angle grain boundary in the SSDB joint. Non-planar grain boundaries in a band of coarse grains were present in the TLPDB joint. The origin of these microstructures and the measured shear strengths of the joints relative to that of the parent sheet are discussed. |
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