| 钨浆料的稳定性研究 |
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| 引用本文： | 林彬,周晓华,罗文忠,吴海斌.钨浆料的稳定性研究[J].电子元件与材料,2012(8):62-65. |
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| 作者姓名： | 林彬 周晓华 罗文忠 吴海斌 |
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| 作者单位： | 电子科技大学微电子与固体电子学院;广东风华高新科技股份有限公司电子工程开发分公司 |
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| 摘 要： | 研究了用于质量分数为96%的氧化铝陶瓷的钨金属化配方以及相应的钨浆料生产工艺。为了提高钨浆料的稳定性,对浆料各组分的形貌、工艺进行了分析,发现粉体形貌、分散工艺、树脂性能对钨浆稳定性影响很大,提出了延长载体制备时间、提高载体黏度、选择粒度分布合理且比表面积较小的粉体等改善措施。结果表明,采用改善措施后在实际生产中取得了良好效果,制得的钨浆料印刷在陶瓷基片上于1 300℃烧结,平均封接强度达到39 MPa。
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| 关 键 词： | 氧化铝陶瓷 钨浆料 金属化 稳定性 |
Study on the stability of tungsten slurry |
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| LIN Bin,ZHOU Xiaohua,LUO Wenzhong,WU Haibin.Study on the stability of tungsten slurry[J].Electronic Components & Materials,2012(8):62-65. |
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| Authors: | LIN Bin ZHOU Xiaohua LUO Wenzhong WU Haibin |
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| Affiliation: | 1.School of Microelectronics and Solid-State Electronics,University of Electronic Science and Technology of China,Chengdu 610054,China;2.Electronic Engineering R&D Branch,Guangdong Fenghua Advanced Technology Co.,Ltd,Zhaoqing 526020,Guangdong Province,China) |
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| Abstract: | The tungsten metallization formula and tungsten slurry production process used in 96%(mass fraction) alumina ceramic were studied.In order to improve the stability of tungsten slurry,the process and ingredients of the slurry were analyzed.It was discovered that powders morphology,dispersing process and resin property had great influences on the stability of the slurry.Improving methods such as extension of the carrier’s preparation time,increasing the viscosity,selecting powders with reasonable size distribution and smaller surface area were proposed.The results show that this methods achieve a very good effect in the actual production.When tungsten slurry is printed on the ceramic substrate sintering at 1 300 ℃,the average sealing strength reaches 39 MPa. |
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| Keywords: | alumina ceramic tungsten slurry metallization stability |
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