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半柔性同轴电缆外导体整体镀锡专用助焊剂
引用本文:王海波,马兆龙,肖鑫,程方杰. 半柔性同轴电缆外导体整体镀锡专用助焊剂[J]. 电子元件与材料, 2012, 0(8): 56-61
作者姓名:王海波  马兆龙  肖鑫  程方杰
作者单位:天津大学材料科学与工程学院;天津市特种设备监督检验技术研究院
基金项目:天津市科技支撑计划资助项目(No.10ZCKFGX03500)
摘    要:经过对溶剂、活性成分和表面活性剂特性的分析,开发了一种半柔性同轴电缆外导体整体镀锡专用助焊剂。实验结果表明,所开发的#4助焊剂[w(己二酸)=1.0%、w(癸二酸)=1.0%、w(阳离子表面活性剂)=0.3%、w(非离子型表面活性剂)=0.1%、乙醇余量]在镀锡过程中气体释放量小,所获得的镀锡层表面连续、光滑,基本上消除了针孔缺陷,同时可以保证锡液能很好地渗透到编织网屏蔽层的内部,形成牢固的镀锡层。

关 键 词:半柔性同轴电缆  助焊剂  3G通讯  针孔缺陷

Special flux for semi-flexible coaxial cable outer conductor holistic tin-dipping process
WANG Haibo,MA Zhaolong,XIAO Xin,CHENG Fangjie. Special flux for semi-flexible coaxial cable outer conductor holistic tin-dipping process[J]. Electronic Components & Materials, 2012, 0(8): 56-61
Authors:WANG Haibo  MA Zhaolong  XIAO Xin  CHENG Fangjie
Affiliation:1(1.Materials Science and Engineering School,Tianjin University,Tianjin 300072,China;2.Tianjin Special Equipment Inspection Institute,Tianjin 300192,China)
Abstract:Basing on the analysis of the solvents,active components and surfactants characters,a kind of fluxes for semi-flexible coaxial cable outer conductor holistic tin-dipping process was developed.The test results show that #4 flux [w(adipic acid)=1.0%,w(sebacic acid)=1.0%,w(cationic surfactant)=0.3%,w(nonionic surfactant)=0.1%,the rest is ethanol]can reduce the gas-generation obviously during tin-plating process and the tin coating is successive and smooth.Meanwhile,the pinhole defects are eliminated and the molten tin can penetrate into inner side of copper braid sufficiently to form close coating.
Keywords:semi-flexible coaxial cable  flux  3G communication  pinhole defects
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