| 非完全阵列分布的电子元器件的热布局优化 |
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| 引用本文： | 田少欣,苏中,马晓飞,赵旭.非完全阵列分布的电子元器件的热布局优化[J].电子元件与材料,2012(8):69-71. |
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| 作者姓名： | 田少欣 苏中 马晓飞 赵旭 |
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| 作者单位： | 北京信息科技大学智能控制研究所 |
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| 基金项目： | 国家自然科学基金资助项目(No.61031001;No.60972118);北京市创新人才资助项目(No.PHR201106226;No.PHR201006115);科技创新平台资助项目(No.71F1210907;No.5028123300);“十二五”预先研究资助项目(No.40405100304;No.9071223301) |
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| 摘 要： | 运用有限元分析软件ANSYS,对含有非完全阵列分布电子元器件的电子设备的稳态温度场分布进行了研究,分析了导致设备过热的主要原因,并根据分析结果对其内部电子元器件的布局进行了优化。结果表明:通过改变电子元器件的位置,电子设备的最高温度和平均温度分别降低了9.914%和9.838%,可靠性得到了提高。
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| 关 键 词： | 非完全阵列 可靠性 稳态温度场 热布局优化 |
Thermal layout optimization of incompletely arrayed electronic components |
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| TIAN Shaoxin,SU Zhong,MA Xiaofei,ZHAO Xu.Thermal layout optimization of incompletely arrayed electronic components[J].Electronic Components & Materials,2012(8):69-71. |
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| Authors: | TIAN Shaoxin SU Zhong MA Xiaofei ZHAO Xu |
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| Affiliation: | (Institute of Intelligence Control,Beijing Information Science & Technology University,Beijing 100101,China) |
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| Abstract: | The steady-state temperature field of a device containing some incompletely arrayed electronic components were studied using a finite element analysis software ANSYS.The main reasons for the overheating of the device were analyzed,and the layout of those incompletely arrayed electronic components was optimized based on the analysis.The results show that the maximum temperature and the average temperature of the device are reduced by 9.914% and 9.838% respectively through optimizing the layout of electronic components.This indicates that the reliability of the device is improved by the layout optimization. |
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| Keywords: | incomplete array reliability steady-state temperature field thermal layout optimization |
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