采用免清洗技术提高波峰焊接质量的研究

对使用“Ｏ型”旋转复合波波峰焊机，配免清洗助焊剂焊接高密度双面及多层ＰＣＢ取得的经验，探讨了免洗焊剂，焊料在波峰焊中的正确选择与使用；并对焊接过程的预热温度、波峰焊温度、轨道倾角等工艺参数调整问题进行了探讨。

Studies on the Improvement of Wave Soldering Quality by Adopting No -Clean Technology

This article describes the experience on the soldering of high density double or multi-layer PCBs using type 0 orbital wave solder machine with Low Residue Flux.Approaches have been made to the proper selection and application of the Low Residue Flux and solder materials as well as the adjustment of technological parameters such as pre-heating tempreture soldering tempreture,and track angle,etc.During the process of wave soldering.