| 建筑用钎焊接头组织与力学性能的研究 |
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| 引用本文： | 张谊.建筑用钎焊接头组织与力学性能的研究[J].粉末冶金工业,2017,27(3). |
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| 作者姓名： | 张谊 |
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| 作者单位： | 湖北文理学院建筑工程学院,湖北 襄阳,441053 |
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| 基金项目： | 湖北省教育厅科学研究计划指导性项目 |
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| 摘 要： | 采用OM、XRD、SEM和拉力试验机,研究了钎焊工艺参数对SnAg0.5CuZn0.1Ni/Cu无铅微焊点界面金属间化合物(IMC)和力学性能的影响。结果表明:添加0.1%Ni(质量分数)能显著细化SnAg0.5CuZn钎料合金的初生β-Sn相和共晶组织;钎焊温度为270℃、钎焊时间为240 s时,钎焊接头的剪切强度达到最大值47 MPa。
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| 关 键 词： | 钎焊 界面 金属间化合物 剪切强度 |
Microstructure and mechanical properties of architectural solder joint |
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| ZHANG Yi.Microstructure and mechanical properties of architectural solder joint[J].Powder Metallurgy Industry,2017,27(3). |
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| Authors: | ZHANG Yi |
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| Abstract: | OM,XRD,SEM and tensile testing were used to study the effects of brazing parameters on the inter-metallic compounds (IMC) and mechanical properties of SnAg0.5CuZn0.1Ni/Cu lead-free solder joints. The re-sults reveal that addition of 0.1%Ni (mass percent) can refine the primary β-Sn phase and eutectic structure of SnAg0.5CuZn solder alloy obviously. The maximum shear strength of 47 MPa is obtained from the joint soldered under the soldering temperature of 270 ℃ and soldering time of 240 s. |
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| Keywords: | soldering interface intermetallic compound shear strength |
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