高界面结合强度铜/钼/铜叠层复合材料的制备研究

采用非平衡态的高能铜离子注入技术,对钼芯材表面进行改性并一次覆铜形成过渡铜层,将原本不固溶的的钼/铜界面转化为铜/铜界面,制得高界面结合强度的铜/钼/铜叠层复合材料;采用近终形的热等静压复合技术进行二次覆铜,结合小变形量冷轧工艺进行复合板材精整,降低各层协同变形量,保证了叠层复合材料的板形、芯层质量、表面粗糙度及平行度。本方法所制备的铜/钼/铜叠层复合材料具有界面结合强度高、板形良好、芯层质量好且平行度好的优点,可作为一种电子封装材料或热沉材料应用于电子、信息技术领域。

Preparation of Cu/Mo/Cu laminated composite material with high interfacial bonding strength

Cu/Mo/Cu (CMC) laminated composite material with high interracial bonding strength was fabricated by the surface modification of molybdenum core material and the generation of copper transition layer through non-equilibrium high energy copper ion implantation.Solid-insoluble molybdenum/copper interface was originally changed into a solid-soluble copper/copper interface.The plate shape,core quality,surface roughness,and parallelism of laminated composite material was guaranteed by the secondary copper composite technology through near-net-shape hot isostatic pressing (HIP),combined with the timishing process of composite sheet through cold rolling with the limited deformation to reduce the cooperative deformation of layers.In the results,the CMC laminated composite material prepared by this method shows the high interfacial bonding strength,good flatness,good core quality,and high parallelism,and can be used as the heat sink for electronic packaging material in the electronics and information technology fields.