| 一种任意层HDI板制作工艺技术的研究 |
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| 引用本文： | 陈世金,罗旭,覃新. 一种任意层HDI板制作工艺技术的研究[J]. 印制电路信息, 2012, 0(6): 28-32 |
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| 作者姓名： | 陈世金 罗旭 覃新 |
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| 作者单位： | 博敏电子股份有限公司,广东梅州,514768 |
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| 摘 要： | 介绍了一种任意层HDI板的制作工艺,针对该类板的制作难点进行分析并提出解决方法。以一种十层任意层HDI板的制作为范例,重点对该制作工艺的激光、线路和电镀等重要制程的控制参数、难点及注意事项进行了讲解,为同行各企业提高生产生产任意层HDI板的技术水平起到抛砖引玉的作用。
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| 关 键 词： | 任意层高密度互连板 激光 填孔电镀 |
A research on the process technology of any layer HDI board |
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| CHEN Shi-jin,LUO Xu,TAN Xin. A research on the process technology of any layer HDI board[J]. Printed Circuit Information, 2012, 0(6): 28-32 |
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| Authors: | CHEN Shi-jin LUO Xu TAN Xin |
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| Affiliation: | CHEN Shi-jin LUO Xu TAN Xin |
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| Abstract: | This article introduced a kind of Any Layer HDI board production technology based on the production difficult and the corresponding resolutions.By taking the 10-layer Any Layer HDI as the model for calligraphy,this paper has stressed the difficulty and the control skill in the process including D/F and panel plating,which provides guidance to improve the technique in the production of Any Layer HDI for occupation. |
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| Keywords: | Any Layer HDI laser drilling filling plating |
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