| 多孔低介电氧化硅陶瓷材料的制备 |
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| 引用本文： | 付振生,金江.多孔低介电氧化硅陶瓷材料的制备[J].陶瓷学报,2011,32(3):385-389. |
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| 作者姓名： | 付振生 金江 |
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| 作者单位： | 南京工业大学材料科学与工程学院,江苏南京,210009 |
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| 摘 要： | 采用氧化硅为原料,木屑作为造孔剂制备了多孔的氧化硅陶瓷材料。借助于气孔率测试、抗弯强度测试、介电性能测试和SEM测试手段分析了造孔剂和烧结助剂的添加量对材料性能的影响。结果表明:加入BN作为添加剂烧成的氧化硅抗弯强度最大可达到14.80MPa。加入木屑作为造孔剂制备的陶瓷可以形成明显的气孔,气孔率最高可达到48.40%,介电常数最低可以达到3.0。
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| 关 键 词： | 多孔材料 低介电常数 氧化硅陶瓷 木屑 |
Preparation of Porous Silicon Ceramics with Low Dielectric Constant |
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| FU Zhensheng,JIN Jiang.Preparation of Porous Silicon Ceramics with Low Dielectric Constant[J].Journal of Ceramics,2011,32(3):385-389. |
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| Authors: | FU Zhensheng JIN Jiang |
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| Affiliation: | FU Zhensheng JIN Jiang(College of Material Science and Engineering,Nanjing University of Technology,Nanjing Jiangsu 210009,China) |
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| Abstract: | The porous silicon ceramic materials were prepared from SiO2 and sawdust.The tests of porosity,flexural strength and dielectric properties and SEM are used to examine the effects of the pore-forming agent and the sintering additives on the properties of the materials.The results show: the highest value of the flexural strength of the sample made with sintering additives can reach 14.80MPa;sawdust is a useful pore-forming agent;the porosity of the sample can reach 48.40%,and the dielectric constant can reach... |
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| Keywords: | porous materials low dielectric constant silicon ceramic sawdust |
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