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New photoimageable dielectric insulating copolyester thin films: Synthesis and characterization
Authors:Frank F Shi  Lizabeth A Schneggenburger  James Economy
Abstract:In this article, we describe the synthesis and characterization of a new family of photoimageable dielectric insulating polymer films. Four different photoimageable thin films have been prepared from all-aromatic and aromatic/aliphatic copolyesters, which exhibit good photospeed (10–180 s, 15.5 mW/cm2 intensity), resolution and line width (10 μm), thermal stability (330–400°C), adhesion on different substrates, mechanical strength, and reasonable glass transition temperature (120–150°C). One feature of the new photoimageable copolyester is the formation of a low dielectric constant film (2.5 at 1 kHz, 25°C) upon curing at temperatures up to 280°C. The low dielectric constant is a result of foaming arising from evolution of by-products during curing. © 1997 John Wiley & Sons, Inc. J Appl Polym Sci 63: 1199–1211, 1997
Keywords:polyester  photoimageable dielectric  photoresist  microelectronics  multichip module
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