| 高亮度高纯度白光LED封装技术研究 |
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| 引用本文： | 王晓军,黄春英,刘朝晖. 高亮度高纯度白光LED封装技术研究[J]. 电子与封装, 2007, 7(3): 16-19 |
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| 作者姓名： | 王晓军 黄春英 刘朝晖 |
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| 作者单位： | 井冈山学院工学院,江西,吉安,343009;井冈山学院工学院,江西,吉安,343009;井冈山学院工学院,江西,吉安,343009 |
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| 摘 要： | 通过对高功率InGaN(蓝)LED倒装芯片结构+YAG荧光粉构成白光LED的分析,可以得出这种结构能提高发光效率和散热效果的结论。通过对白光LED的构成和电流/温度/光通量的分析,可知在蓝宝石衬底和环氧树脂的界面间涂敷一层硅橡胶能改善光的折射率。改进光学器件的封装技术,可以大幅度提高大功率LED的出光率(光通量)。
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| 关 键 词： | 高功率白光LED 倒装结构 发光效率 |
| 文章编号： | 1681-1070（2007）03-0016-04 |
| 收稿时间： | 2006-08-21 |
| 修稿时间： | 2006-08-21 |
Research of the High Luminosity and Purity White LED Encapsulation Technology |
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| WANG Xiao-jun,HUANG Chun-ying,LIU Zhao-hui. Research of the High Luminosity and Purity White LED Encapsulation Technology[J]. Electronics & Packaging, 2007, 7(3): 16-19 |
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| Authors: | WANG Xiao-jun HUANG Chun-ying LIU Zhao-hui |
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| Abstract: | By analyzing the flip chip structure of high power InGaN blue +YAG fluorescence powders white light emitting diode (LED), it shows that it can improve the luminous and heat dissipation efficacy. And by analyzing the composing of white LED and relations between current, temperature and luminous flux, refractive index is improved the interface between the sapphire underlay and epoxy resin by gelatinizing a layer silica gel. By improving the optical encapsulation, the luminous flux of LED can be improved greatly. |
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| Keywords: | high power white LED flip chip structure luminous efficacy |
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