| (SiC)p表面低成本化学改性的研究 |
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| 引用本文： | 宿辉,王桂芳,栾风虎,胡胜鹏.(SiC)p表面低成本化学改性的研究[J].表面技术,2007,36(2):21-23. |
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| 作者姓名： | 宿辉 王桂芳 栾风虎 胡胜鹏 |
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| 作者单位： | 1. 黑龙江工程学院材料与化学工程系,黑龙江,哈尔滨,150050
2. 哈尔滨工程大学材料科学与工程系,黑龙江,哈尔滨,150001 |
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| 基金项目： | 黑龙江省科技攻关项目
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黑龙江工程学院优秀青年基金
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黑龙江省自然科学基金 |
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| 摘 要： | 为解决裸(SiC)P在应用中存在的不足,提出(SiC)P表面低成本化学改性的思路.采用简单的化学镀技术,改进氧化、亲水、敏化和活化的前处理工艺,对(SiC)P进行表面化学改性.确定了最佳的试验工艺,获得了镀层连续、无光滑(SiC)P裸露的较高质量的碳化硅复合粉体简写为(Ni/SiC)P],通过SEM、EDS、XRD、TEM等测试,结果表明:改性后的(Ni/SiC)P较改性前的(SiC)P导电性有所提高,形貌、组成发生改变.同时分析了热处理对(Ni/SiC)P的影响,结果表明:随着温度的升高,(Ni/SiC)P表面改性层中的镍由非晶态转化为晶态.
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| 关 键 词： | (SiC)P 碳化硅复合粉体 表面改性 化学镀 热处理 表面改性层 成本 表面化学改性 研究 Modification Chemistry Low Cost 非晶态 转化 温度 影响 热处理 分析 发生 组成 导电性 结果 测试 简写 复合粉体 |
| 文章编号： | 1001-3660（2007）02-0021-03 |
| 收稿时间： | 2006/10/27 0:00:00 |
| 修稿时间： | 2006-10-27 |
Study on Low Cost Chemistry Modification on ( SiC) p |
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| XU Hui,WANG Gui fang,LUAN Feng-hu and HU Sheng-peng.Study on Low Cost Chemistry Modification on ( SiC) p[J].Surface Technology,2007,36(2):21-23. |
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| Authors: | XU Hui WANG Gui fang LUAN Feng-hu and HU Sheng-peng |
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| Affiliation: | 1. Department of Materials and Chemistry Engineering, 2. Department of Materials Science and Engineering, Heilongjiang Engineering Institute, Harbin 150050, China; Harbin Engineering University, Harbin 150001, China |
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| Abstract: | For solving shortage of naked(SiC)P in the application,the surface low cost chemistry modification on(SiC)P was expound.The simple electroless plating improved the pre-treatments technology including oxidation,geting close to water,sensitization and activation process.The continual,non-lubricous and high quality decoration of(SiC)P(abbreviate as(Ni/SiC)P) was obtained.Experiment results of SEM,EDS,XRD and TEM indicate that the electric functions of(Ni/SiC)P is much higher than those of unembellished(SiC)P,and morphology and structure of(Ni/SiC)P are changed.The effect of heat treatment on(Ni/SiC)P was also analyzed.The result expresses that along with the temperature,the noncrystalline state nickel in surface modified layer on(Ni/SiC)P becomes crystalline state nickel along with the going up of temperature. |
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| Keywords: | (SiC)P (Ni/SiC)P Surface modification Electroless plating Heat treatment |
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