| 高性能BT树脂基覆铜板的研制 |
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| 引用本文： | 张龙庆,张春华,邱维波. 高性能BT树脂基覆铜板的研制[J]. 电子元件与材料, 2003, 22(9): 27-29 |
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| 作者姓名： | 张龙庆 张春华 邱维波 |
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| 作者单位： | 上海市合成树脂研究所,上海,200235;上海市合成树脂研究所,上海,200235;上海市合成树脂研究所,上海,200235 |
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| 摘 要： | 研制出了双烯封端棒状聚酰亚胺,并用其改性BT树脂,制得了低收缩BT树脂/石英布覆铜板。其平面方向热膨胀系数为3.1106℃1,厚度方向为1.3105℃1,优于国外同类产品;另用聚苯醚改性BT,制得低介电常数的BT树脂/玻璃布覆铜板,其er可小到3.6(106 Hz),厚度方向热膨胀系数为4.07×105℃1。改性后保留了BT树脂的其它优良特性。
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| 关 键 词： | BT树脂覆铜板 棒状聚酰亚胺预聚体 低热膨胀系数BT树脂 低介电常数BT树脂 |
| 文章编号： | 1001-2028(2003)09-0027-03 |
Preparation of Copper Clad Laminates with High Performance BT Resin |
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| ZHANG Long-qing,ZHANG Chun-hua,QIU Wei-bo. Preparation of Copper Clad Laminates with High Performance BT Resin[J]. Electronic Components & Materials, 2003, 22(9): 27-29 |
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| Authors: | ZHANG Long-qing ZHANG Chun-hua QIU Wei-bo |
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| Abstract: | Rod-like polyimide capped with biethenylene was developed and used in the modification of bismaleimide/triazine-based resin (BT resin). Of the low expansion coefficient copper clad laminates based on thus modified BT resin and quartz fabric, the expansion coefficient is 3.1106C1 (x-y orientation) and 1.3105C1 (z orientation). BT resin was also modified by polyphenyl oxide. Of the low dielectric copper clad laminates based on thus modified BT resin and glass fabric, er is as low as 3.6, at 106 Hz, and expansion coefficient 4.07105C1 (z orientation). The original excellent properties of the BT resin remain the same after the modification. |
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| Keywords: | copper clad laminates based BT resin rod-like polyimide prepolymers low thermal expansion coefficient BT resin low dielectric constant BT resin |
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