| 电子设备的热设计研究 |
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| 引用本文： | 张斌. 电子设备的热设计研究[J]. 广西机械, 2012, 0(1): 63-65 |
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| 作者姓名： | 张斌 |
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| 作者单位： | 中国电子科技集团公司第五十四研究所,河北石家庄050081 |
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| 摘 要： | 分析了现代电子设备热流密度的特点,强调了热设计重要性,概括了热设计所涉及到内容,分别从导热、对流和热辐射三方面简要介绍了传热学的基本原理,根据传热学基本原理介绍了热设计方式的选择和几种常见的设计方式及特点。
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| 关 键 词： | 电子设备 热设计 传热学 结构设计 |
Research on Thermal Design for Electronic Equipment |
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| ZHANG Bin. Research on Thermal Design for Electronic Equipment[J]. Guangxi Machinery, 2012, 0(1): 63-65 |
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| Authors: | ZHANG Bin |
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| Affiliation: | ZHANG Bin(The 54th Research Institute of CETC,Shijiazhuang 050081,China) |
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| Abstract: | This paper analyzes characteristics of heat flow density for modern electronic equipment,emphasizes the importance of design of heat flow density,and summarizes the contents involving to thermal design.The paper introduces briefly fundamental principle of thermal conducting from there points of view,that is heat conducting,heat exchange,and heat radiation.According to the basic principle of thermal conducting,how to select thermal design is introduced,and several thermal designs and their characteristics used commonly are described. |
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| Keywords: | electronic equipments thermal design heat transfer structure design |
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