Adhesive Dispensing Process Analysis: Steady-State Dispensing of One-Component Adhesives

The process of dispensing one-component heat-cure adhesives was investigated in order to understand current application processes and to guide new process development. Typical one-component adhesives exhibit non-Newtonian rheological behavior, and hence Newtonian fluid mechanics does not adequately describe the dispensing process. In the present study, the adhesives were modeled as Bingham fluids possessing a yield stress and a steady state viscosity. The model of the dispensing apparatus includes four major flow sections connected in a serial configuration. The fluid mechanics equations derived for Bingham fluids in the individual flow sections were solved by numerical methods in order to understand the interrelationships between the material variables (e.g. yield stress, viscosity, temperature dependencies) and process variables (e.g. pressure, flow geometry, temperature, output). The concept of the model is generic and the details of the model can be modified for any forced-flow adhesive application process.

The adhesive flow properties significantly influence the process output. Dispensing temperature, among the process variables, has the strongest effect on process output. A ± 1.0·C perturbation in the dispensing temperature can cause as much as a 14% variation in the bead size for the range of adhesives studied. Differences in flow characteristics result in differences in processability and non-linear temperature/pressure sensitivity. The non-linear sensitivity can be eliminated by operating the dispensing process isothermally. Finally, the process limits for one-component adhesives, which are susceptible to chemical instability induced by viscous heating during processing, are defined and discussed in terms of a modified Brinkman number that takes into account viscous dissipation, heat conduction and convection, and chemical stability of the material during processing.