| 电子封装技术的最新进展 |
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| 引用本文： | 傅岳鹏,谭凯,田民波. 电子封装技术的最新进展[J]. 半导体技术, 2009, 34(2) |
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| 作者姓名： | 傅岳鹏 谭凯 田民波 |
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| 作者单位： | 清华大学材料科学与工程系,北京,100084;清华大学材料科学与工程系,北京,100084;清华大学材料科学与工程系,北京,100084 |
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| 摘 要： | 现今集成电路的特征线宽即将进入亚0.1nm时代,根据量子效应这将是半导体集成的极限尺寸,电子产品小型化将更有赖于封装技术的进步.概括总结了SiP三维封装、液晶面板用树脂芯凸点COG封装、低温焊接等技术的最新进展.并对SiP三维封装技术中封装叠层FFCSP技术进行了着重的阐述.指出随着低温焊接、连接部树脂补强以及与Si热膨胀系数相近基板的出现,电子封装构造的精细化才能成为可能,为各种高密度封装、三维封装打下坚实基础.
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| 关 键 词： | 系统封装 玻璃板上封装 挠性载带包覆芯片级封装 低温焊接 |
Recent Development of Electronic Packaging Technology |
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| Fu Yuepeng,Tan Kai,Tian Minbo. Recent Development of Electronic Packaging Technology[J]. Semiconductor Technology, 2009, 34(2) |
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| Authors: | Fu Yuepeng Tan Kai Tian Minbo |
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| Affiliation: | Department of Materials Science and Engineering;Tsinghua University;Beijing 100084;China |
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| Abstract: | The current IC line width characteristics is near sub-0.1 nm scale,according to the quantum effect,it will be the ultimate size of the semiconductor integration.The miniaturization process of electronic products will depend on the packaging technology.The current 3D SiP packaging technology,resin-core bump COG package on LCD panels,and low-temperature soldering are summarized.It also focuses on the 3D package-stack FFCSP packaging technology.The trend in development of electronic packaging technology is als... |
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| Keywords: | SiP COG FFCSP low-temperature soldering |
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