SMT-TAB: A process planning system for PCB assembly using TAB and SMT |
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Authors: | K. Srihari PhD Sundarraman Raghavan |
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Affiliation: | (1) Department of Mechanical and Industrial Engineering, T. J. Watson School of Engineering and Applied Science, State University of New York, 13902-6000 Binghamton, NY, USA |
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Abstract: | Process planning is a critical function in any manufacturing domain. This is especially true in the electronics manufacturing area where substantial heuristic and experiential knowledge is commonly used during process plan development. While research in computer-aided process planning (CAPP) has tended to concentrate in the machining realm, few CAPP systems have been developed for electronics manufacturing applications and more specifically for the printed circuit board (PCB) assembly domain. Besides, the CAPP systems that have been developed for this area have dealt with either insertion mount or surface mount PCB assembly processes only.Tape automated bonding (TAB), though a relatively new technology, is gaining importance in electronics assembly owing to its inherent advantages. The advent of fine pitch technology together with the ever increasing need for more inputs/outputs and greater pin counts in integrated circuit applications has enhanced the use of TAB technology in electronics manufacturing. This trend has been further augmented by the increasing need for compactness in consumer electronics.This research designed and developed a prototype CAPP system for the PCB assembly domain. The system developed generates a process plan for PCBs populated with surface mount and/or TAB components. An artificial-intelligence based expert system approach has been used in the design and development of the CAPP system. Outputs generated by the system are presented along with ideas for future research. |
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Keywords: | Computer-aided process planning (CAPP) Expert systems Printed circuit boards (PCBs) Surface mount technology (SMT) Tape automated bonding (TAB) |
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