Post-annealing Effect on Microstructures and Thermoelectric Properties of Bi0.45Sb1.55Te3 Thin Films Deposited by Co-sputtering

p-Type Bi_0.45Sb_1.55Te₃ thermoelectric (TE) thin films have been prepared at room temperature by a magnetron cosputtering process. The effect of postannealing on the microstructure and TE properties of Bi_0.45Sb_1.55Te₃ films has been investigated in the temperature range from room temperature to 350°C. x-Ray diffraction analysis shows that the annealed films have polycrystalline rhombohedral crystal structure, and the average grain size increases from 36?nm to 64?nm with increasing annealing temperature from room temperature to 350°C. Electron probe microanalysis shows that annealing above 250°C can cause Te reevaporation, which induces porous thin films and dramatically affects electrical transport properties of the thin films. TE properties of the films have been investigated at room temperature. The hole concentration shows a trend from descent to ascent and has a minimum value at the annealing temperature of 200°C, while the Seebeck coefficient shows an opposite trend and a maximum value of 245?μV?K^?1. The electrical resistivity monotonically decreases from 19.8?mΩ?cm to 1.4?mΩ?cm with increasing annealing temperature. Correspondingly, a maximum value of power factor, 27.4?μW?K^?2?cm^?1, was obtained at the annealing temperature of 250°C.