| 溅射沉积Cu-W合金薄膜的结构及力学性能 |
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| 引用本文： | 郭中正,孙勇,段林昆,郭诗玫,李玉阁. 溅射沉积Cu-W合金薄膜的结构及力学性能[J]. 稀有金属, 2010, 34(1). DOI: 10.3969/j.issn.0258-7076.2010.01.008 |
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| 作者姓名： | 郭中正 孙勇 段林昆 郭诗玫 李玉阁 |
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| 作者单位： | 1. 昆明理工大学云南省新材料制备与加工重点实验室,云南,昆明,650093
2. 曲靖师范高等专科学校,云南,曲靖,655000 |
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| 基金项目： | 云南省自然科学基金重点资助项目，国家自然科学基金，云南省自然科学基金 |
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| 摘 要： | 用磁控共溅射法制备Cu-W合金薄膜,运用EDX,XRD,TEM,SEM和纳米压痕仪对薄膜成分、结构和力学性能及其关系进行了研究。结果表明,含W较低的Cu82.1W17.9(%,原子分数)和W浓度较高的Cu39.8W60.2薄膜为晶态结构且出现固溶度扩展,分别存在fccCu(W)亚稳过饱和固溶体(固溶度4.8%W)和bccW(Cu)亚稳过饱和固溶体(固溶度5.7%Cu),W含量为31.8%,45.7%,54.8%的Cu-W薄膜呈非晶态,表面粗糙度较晶态Cu-W薄膜低。总体上非晶Cu-W薄膜弹性模量E和硬度H值较低,fccCu-W膜实测E值介于Voigt和Reuss规则预测值之间,bcc和非晶Cu-W膜实测E值分别高于和低于预测值;晶态Cu-W膜实测H值与Voigt规则计算值的符合性优于非晶膜,薄膜结构对力学性能预测可靠性影响较大。
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| 关 键 词： | Cu-W合金薄膜 微观结构 非晶态 力学性能 |
Structure and Mechanical Properties of Cu-W Alloy Thin Films Deposited by Sputtering |
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| Guo Zhongzheng,Sun Yong,Duan Lingkun,Guo Shimei,Li Yuge. Structure and Mechanical Properties of Cu-W Alloy Thin Films Deposited by Sputtering[J]. Chinese Journal of Rare Metals, 2010, 34(1). DOI: 10.3969/j.issn.0258-7076.2010.01.008 |
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| Authors: | Guo Zhongzheng Sun Yong Duan Lingkun Guo Shimei Li Yuge |
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| Affiliation: | Guo Zhongzheng1,Sun Yong1,Duan Lingkun1,Guo Shimei2,Li Yuge1 (1. Key Laborary of Advanced Materials Yunnan Province,Kunming University of Science , Technology,Kunming 650093,China,2. Qujing Normal University,Qujing 655000,China) |
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| Abstract: | The composition,structure,mechanical properties of Cu-W alloy thin films fabricated by magnetron co-sputtering were investigated by EDX,XRD,TEM,SEM and nanoindenter. The results showed that Cu82.1W17.9(%,atom fraction) with lower W content and Cu39.8W60.2 with higher W concentration thin films were of crystalline state with the presence of fcc Cu(W) metastable supersaturated solid solution with maximum W solubility of 4.8% and bcc W(Cu) metastable supersaturated solid solution with maximum Cu solubility of ... |
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| Keywords: | Cu-W alloy thin films microstructure amorphous mechanical properties |
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