Effect of organic/inorganic coating on moisture diffusion in a chip-on-board package with globtop

The moisture diffusion in globtop material for a chip-on-board (COB) package coated with SiN_x and silicone, respectively, or coated with SiN_x plus silicone were measured by embedding a humidity sensor in the globtop and recording the capacitive change in three different temperature/humidity environments. The experimental results were simulated by Fick’s diffusion law with finite-element method modeling. The moisture diffusion coefficients and activation energies were calculated to quantitatively compare the moisture-resistance effects of different coatings. For example, at 85°C/85% RH, the moisture diffusion coefficients for the uncoated reference, SiN_x-coated, silicone-coated, and silicone/SiN_x double-layered coated samples are 1E-5, 0.8E-5, 0.7E-5, and 0.2E-5 mm²/s, respectively. The experimental and simulation results show that double-layered coating with silicone/SiN_x has excellent moisture-resistance properties because it not only smoothes the steps on a printed circuit board (PCB) but also keeps the good moisture resistance of the inorganic films.