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Laser beam backside probing of CMOS integrated circuits
Authors:Steven Kasapi   Chun-Cheng Tsao   Ken Wilsher   William Lo  Seema Somani
Affiliation:1. Schlumberger ATE, 1601 Technology Drive, San Jose, CA 95110, USA;1. Ecole Nationale Polytechnique, Algiers, Algeria;2. Microelectronics and Nanotechnology Division, Centre de Développement des Technologies Avancées (CDTA), 20 Août 1956, Baba Hassen, BP: 17, Algiers 16303, Algeria;3. Institute of Information and Communication Technologies, Electronics and Applied Mathematics (ICTEAM), Université catholique de Louvain (UCL), Place du Levant, 3, Maxwell Building, bte L5.03.02, B-1348 Louvain-la-Neuve, Belgium;1. Department of Vehicle Engineering, Army Academy of Armored Forces, Beijing, People’s Republic of China;2. School of Engineering, Newcastle University, Newcastle upon Tyne NE1 7RU, United Kingdom;1. Laboratory of Condensed Matter and Renewable Energy, Faculty of Sciences and Technology, University Hassan II of Casablanca, BP146 Mohammedia, Morocco;2. Superior School of Technology, Materials Physics and Subatomic Laboratory, Ibn-Tofail University, PB 242, 14000 Kenitra, Morocco;3. Faculty of Science and Technology, Jan Dlugosz University in Czestochowa, Al. Armii Krajowej 13/15, 42201, Czestochowa, Poland;4. Faculty of Technology, University of Saad, Dahlab Blida 1, Blida, Algeria
Abstract:We have developed a new, fully integrated circuit timing analysis tool that provides measurements of electrical waveforms by direct access to the diffusion nodes through the backside of CMOS integrated circuits. The system, known as the IDS 2000, allows the device to be driven at full speed by a wide variety of testers. Utilising an actively modelocked infrared laser beam, the system can detect waveforms with ultrahigh bandwidth ( 10 GHz) from CMOS devices using stroboscopic sampling. The system has proven to be an powerful tool for design debug and failure analysis of flip chip packaged IC as well as any other packaged IC where the silicon side can be thinned and directly accessed.
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