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感应加热电饭煲涡流场与温度场分析
引用本文:阚超豪,储国良,张家午,马伯.感应加热电饭煲涡流场与温度场分析[J].沈阳工业大学学报,2014,36(6):613-618.
作者姓名:阚超豪  储国良  张家午  马伯
作者单位:合肥工业大学 电气与自动化工程学院, 合肥 230009
基金项目:国家自然科学基金资助项目,安徽省自然科学基金资助项目(1208085ME62).
摘    要:为了研究感应加热电饭煲的工作情况及相关结构参数对其性能的影响,以一台1 300 W感应加热电饭煲为例,建立了以sus430为主要涡流发热材料的三维电磁场有限元模型,分析了导体中涡流场的分布情况,并分别改变相关结构参数比较涡流功率的变化趋势.利用workbench软件分析研究其温度场,将仿真结果与样机实测温度值对比,验证了仿真方法的正确性.通过有限元法对感应加热电饭煲三维涡流场和三维温度场的研究,为相关感应加热系统的优化设计提供了可靠依据.

关 键 词:多层导电结构  电磁感应  感应加热  涡流场  涡流效应  热源  涡流功率  温度场  

Analysis on eddy current field and temperature field of induction heating cooker
KAN Chao-hao,CHU Guo-liang,ZHANG Jia-wu,MA Bo.Analysis on eddy current field and temperature field of induction heating cooker[J].Journal of Shenyang University of Technology,2014,36(6):613-618.
Authors:KAN Chao-hao  CHU Guo-liang  ZHANG Jia-wu  MA Bo
Affiliation:College of Electrical & Automatic Engineering, Hefei University of Technology, Hefei 230009, China
Abstract:In order to study the working condition of induction heating cooker and the effect of relative structural parameters on the performances of the cooker, a 1300W induction heating cooker was taken as an example, and a 3D finite element electromagnetic field model was established through taking sus430 as the main eddy heating material. In addition, the distribution of eddy current field in the conductor was analyzed. The variation trend of eddy current power was compared through changing the relative structural parameters. The temperature field was analyzed and studied with the workbench software. Moreover, the simulated results were compared with the measured temperature values, and the correctness of simulation method was verified. The study on the 3D eddy current field and 3D temperature filed of induction heating cooker with the finite element method can provide a reliable basis for the optimal design of relative induction heating system.
Keywords:multi-layered conductive structure  electromagnetic induction  induction heating  eddy current field  eddy current effect  heat source  eddy current power  temperature field
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