焦磷酸盐镀铜生产工艺(Ⅲ)

13常见故障及其排除方法[1,4,12] 13.1镀层粗糙、毛刺和结瘤 基体金属或预镀层粗糙;镀液中有"铜粉"或其他固体悬浮粒子;镀液中有机杂质过多,铅等异金属杂质过多或被CN-沾污;镀液pH值太高;温度偏高;电流密度过大;阳极溶解不正常;铜含量过高或焦磷酸钾含量过低等都会引起镀层粗糙、毛刺和结瘤.

Process for Electroplating of Copper in Pyrophosphate Bath

The processes for electroplating of copper in a pyrophosphate bath were elucidated in details with respect to the pretreatment, pre- plating, bath formulation, plating conditions and principle, preparation of plating bath, bath composition and action of each ingredient, effect of operating conditions on the performance of the copper coating, maintenance of the plating bath, effect of the impurities and the methods to remove the impurities, effect of maladjustment of bath composition and correction, effect of phosphate radicle on the bath stability and coating performance, generation and removal of copper powders, and common faults and methods for troubleshooting. At the same time, the methods to analyze phosphate and pyrophosphate radicles in theplating bath and that to remove unqualified copper coating were briefed as well.