| 激光键合技术在封装中的应用及研究进展 |
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| 引用本文： | 田艳红,王春青,孔令超.激光键合技术在封装中的应用及研究进展[J].电子工业专用设备,2007,36(5):22-28. |
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| 作者姓名： | 田艳红 王春青 孔令超 |
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| 作者单位： | 哈尔滨工业大学现代焊接生产技术国家重点实验室微连接研究室,黑龙江,哈尔滨,150001 |
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| 摘 要： | 激光键合技术以其局部非接触加热、灵活性强和可控性能好的优点在电子封装、光电子封装以及MEMS封装中得到了应用。以几种激光键合技术的研究和应用为实例,分析和探讨了激光键合技术中的关键问题及其发展趋势。
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| 关 键 词： | 激光键合技术 电子封装 光电子封装 MEMS封装 |
| 文章编号： | 1004-4507（2007）05-0022-07 |
| 修稿时间： | 2007-04-18 |
Application and Research Progress of Laser Bonding Technology in Packaging |
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| TIAN Yan-hong,WANG Chun-qing,KONG Ling-chao.Application and Research Progress of Laser Bonding Technology in Packaging[J].Equipment for Electronic Products Marufacturing,2007,36(5):22-28. |
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| Authors: | TIAN Yan-hong WANG Chun-qing KONG Ling-chao |
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| Affiliation: | Microjoing Lab, State Key Lab of Advanced Welding Production Technology, Harbin Institute of Technology, Harbin 150001, China |
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| Abstract: | Laser bonding technelogy, which offters the advantages of non-contact, local heating and flexibility, has attracted more attention in electronic, optoelectronic and MEMS packaging. In this paper, several case studies on laser bonding technologies were presented, and major problems in research and applications as well as the trend of laser bonding technology were analysed and discussed. |
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| Keywords: | Laser bonding technology Electronic packaging Optoelectronic packaging MEMS packaging |
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