| 无铅焊接合金的制备及性能研究 |
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| 引用本文： | 符岩,翟秀静,张晓顺,张卓,马林芝,范川林,宋明秋.无铅焊接合金的制备及性能研究[J].功能材料,2007,38(A08):3263-3266. |
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| 作者姓名： | 符岩 翟秀静 张晓顺 张卓 马林芝 范川林 宋明秋 |
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| 作者单位： | [1]东北大学材料与冶金学院,辽宁沈阳110004 [2]中国刑事警察学院,辽宁沈阳110035 |
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| 摘 要： | 制备了Sn-Zn、Sn-Zn-Bi、Sn-Zn-Bi-RE与Sn-Zn-Bi-Ag系无铅焊接合金，研究了合金的熔点、熔化温度区间、对铜板的润湿性、微观结构和电化学性能。实验结果表明：Bi元素的加入能够降低Sn-Zn合金的熔点，但熔化温度区间增大；Bi、Ag、混合RE能够细化晶粒，使组织更均匀；电化学研究表明，加入适量的混合RE和Ag可提高合金的耐腐蚀性。
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| 关 键 词： | 焊接合金 Sn-Zn合金 熔点 润湿性 耐腐蚀性 |
| 文章编号： | 1001-9731（2007）增刊-3263-04 |
| 修稿时间： | 2007-05-07 |
Study on the preparation and performance of the lead-free solder alloy |
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| FU Yan, ZHAI Xiu-jing, ZHANG Xiao-shun, ZHANG Zhuo, MA Lin-zhi, FAN Chuan-lin, SNG Ming-qiu.Study on the preparation and performance of the lead-free solder alloy[J].Journal of Functional Materials,2007,38(A08):3263-3266. |
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| Authors: | FU Yan ZHAI Xiu-jing ZHANG Xiao-shun ZHANG Zhuo MA Lin-zhi FAN Chuan-lin SNG Ming-qiu |
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| Affiliation: | FU Yan, ZHAI Xiu-jing, ZHANG Xiao-shun, ZHANG Zhuo, MA Lin-zhi, FAN Chuan-lin, S0NG Ming-qiu |
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| Abstract: | The Sn-Zn, Sn-Zn-Bi, Sn-Zn-Bi-RE and Sn-Zn-Bi-Ag lead-free solder alloy series were prepared in this work. The melting point, melting tempreture range, wettability with copper plate, microstructure and eletrochemical properties of the alloy were investigated. The result showed that the melting point of the Sn-Zn alloy was decrease by adding Bi, but the melting temperature range was wider; the grain was refined and the structure was more homogeneous through Bi and Ag mixed with RE; the eletrochemical study showed that andding the mixture of RE and Ag properly can improve the corrosion resistance of the alloys. |
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| Keywords: | solder alloy Sn-Znalloy melting point wettability corrosion resistance |
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