塑封胶吸湿对器件分层影响的研究

进行3种塑封胶的吸湿试验来证实其在相同器件中的不同可靠性表现由吸湿量的差异造成,得到了树脂相同的塑封胶的吸湿量与二氧化硅填充量之间的关系。证实了MSL3条件下塑封胶吸湿遵循Fick定律,并且得到了MSL3条件下3种塑封胶中湿气的扩散系数。综合考虑回流过程中蒸汽压、塑封胶吸湿膨胀和热膨胀,进行了界面分层风险的定量分析。

Influence of Moisture Absorption of Compound on Delamination

The moisture absorption experiments of three kinds of molding compound were carded out to confirm that large difference of mechanical reliability performance between different molding compound for the same device in our project was induced by moisture absorption difference, and the relation between the moisture weight absorbed and filler content was obtained, given compounds of same resin. It was substantiated that the moisture absorption of molding compound observes the Fick's law at MSL3, and the diffusion coefficients of different molding compound were obtained. Quantitative analyses of the moisture influence at the risk location with the consideration of vapor pressure during solder reflow, moisture and thermal expansion were conducted to evaluate the risk of delamination.