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50mm厚700MPa级别低碳贝氏体钢板AH70DB的开发
引用本文:张富强,孙斌,成晓举.50mm厚700MPa级别低碳贝氏体钢板AH70DB的开发[J].宽厚板,2014(3):38-41.
作者姓名:张富强  孙斌  成晓举
作者单位:安阳钢铁集团有限责任公司
摘    要:通过添加不同的微合金元素,结合TMCP+回火工艺,试验了3种不同成分体系的低碳贝氏体钢板AH70DB,研究了在相同轧制工艺和热处理条件下成分对组织及性能的影响,最终成功开发出50 mm厚度700 MPa级别AH70DB低碳贝氏体钢板产品。

关 键 词:低碳贝氏体钢  厚规格  TMCP工艺  回火

Development of 50 mm Thickness 700 MPa Grade Low Carbon Bainitic Steel Plate AH70DB
Zhang Fuqiang,Sun Bin,Cheng Xiaoju.Development of 50 mm Thickness 700 MPa Grade Low Carbon Bainitic Steel Plate AH70DB[J].Wide and Heavy Plate,2014(3):38-41.
Authors:Zhang Fuqiang  Sun Bin  Cheng Xiaoju
Affiliation:(Anyang Iron and Steel Group Co. Ltd)
Abstract:By adding different microalloying elements,combining with TMCP and tempering process,Angang conducts tests on low carbon bainitic steel plate AH70DB with three component systems,studies the effects of chemical composition on microstructure and mechanical properties of the steel plate with the same rolling and heat treatment process,and successfully develops 50mm thickness 700MPa grade low carbon bainitic steel plate.
Keywords:Low carbon bainitic steel  Heavy gauge  TMCP  Tempering
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