型面约束下的真空钎焊金刚石工艺及其等高性分析

在真空炉中采用石墨阴模对金刚石进行适当约束的方法开展钎焊试验，实现了金刚石与钢基体之间的高强度连接及磨粒等高性的有效控制. 采用SEM对钎焊试样和金刚石表面形貌进行观察，采用EDS对金刚石表面定点和微区成分进行分析，使用超景深三维显微镜对磨粒等高性进行测量. 结果表明，液相Cu70Sn20Ti10钎料在毛细作用下可润湿包裹在石墨阴模上粘接的金刚石，且两者界面上形成TiC反应物，由此可获得钢基体对金刚石高的把持力. 钎焊过程银胶不与金刚石发生反应，同时由于银胶能够始终保持对金刚石的粘接及约束作用，所以钎焊后的磨粒等高性好.

Vacuum brazing diamond process under the profile constraint and analysis of agreed height abrasives

The brazing experiments in vacuum furnace were carried by a special method of keeping diamond within the bounds of graphite template, which realized a high bonding strength between steel matrix and diamond and an effective way to control agreed height abrasives. Welded joints and morphology of diamond surface were observed by SEM. Fixed-point and micro-region compositions on the diamond surface were analyzed by EDS. The agreed height abrasives were measured by super-field 3D microscope. Results show that liquefied Cu70Sn20Ti10 solder under capillary action can infiltrate and enclose diamond on the profile of graphite template through splicing and steel matrix have a high holding power for diamond due to the formed TiC on bonding interfaces. Silver colloid and diamond can''t generate reaction during brazing process. As silver colloid can always have good bonding and constraint effect for diamond, agreed height of abrasives is satisfactory after brazing process.