黑瓷熔封工艺中导电胶与芯片厚度的研究

烧结气氛、烧结温度、升降温速率等是陶瓷熔封工艺的必要条件，但导电胶在一定温度下受热分解，释放出的气体量的多少也是影响陶瓷熔封工艺的重要因素。因此，增加预烘工艺，改变导电胶组分，都可以在封盖过程中最大限度地减少导电胶中气体量的排放。同时，由于高温下气体过于集中，会导致器件泄漏。而芯片表面积及厚度不同，对管壳内腔体气流运行阻碍程度也不同，其中芯片厚度对腔体内气流阻滞作用特别明显。文章介绍了导电胶以及芯片厚度对黑瓷熔封工艺的影响，并对其应用进行了研究。

The Research of Conducting Adhesive and Thickness of Chip in the Black Ceramic Packaging Hermetic Sealing Process

These are the essential conditions that the ceramic packaging hermetic sealing process need,such as Sintering atmosphere,sintering temperature,ascending and descending velocity of temperature etc.but it is an important factor which influences the ceramic packaging hermetic sealing process that the conducting adhesive at certain temperature is subjected to hot decomposition and the air which releases.So adding to prepared roast process and changing the component of conducting adhesive can reduce the exhaust ...