首页 | 本学科首页   官方微博 | 高级检索  
     

单晶硅材料机械性能研究及进展
引用本文:李东升,杨德仁,阙端麟. 单晶硅材料机械性能研究及进展[J]. 材料科学与工程学报, 2000, 18(3): 100-104
作者姓名:李东升  杨德仁  阙端麟
作者单位:浙江大学硅材料国家重点实验室,浙江,杭州,310027
摘    要:本文综述了硅材料的机械性能研究进展和相应的研究方法。利用高温拉伸、抗弯测试和显微压痕测试等研究手段 ,指出硅材料表面状况、位错和杂质是其机械性能的主要影响因素。表面损伤将降低硅单晶的拉伸屈服强度和抗弯强度 ;而位错的产生和滑移也可降低单晶的机械性能 ,但杂质对位错的钉扎将起到强化单晶机械性能的作用。

关 键 词:单晶硅  机械性能

Progress in Study of Crystal Silicon Mechanical Properties
LI Dong-sheng,YANG De-ren,QUE Duan-lin. Progress in Study of Crystal Silicon Mechanical Properties[J]. Journal of Materials Science and Engineering, 2000, 18(3): 100-104
Authors:LI Dong-sheng  YANG De-ren  QUE Duan-lin
Abstract:The progress in study of the mechanical properties of monocrystalline silicon have been reviewed. By means of tensile tests at high temperature, bending strength and indentation, it is found that the mechanical properties of silicon mainly depend on surface states, dislocations and impurities. The upper yield strength and bending strength decrease with the damage on surface, as well as the generation and movement of dislocations. However, through pinning dislocations, the impurities can strengthen the mechanical properties of crystal silicon.;
Keywords:monocrystalline silicon  mechanical properties
本文献已被 CNKI 万方数据 等数据库收录!
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司  京ICP备09084417号